I most certainly agree with you in that the less of the heat-sink compound one can use, the better.
However, in the case of these F521s which I discovered had heat-sink compound issues, the issue was that the OEM used so little of it that there were large areas which had none at all !!!
Furthermore, in the F521s, there are TWO "sandwiches" which must be considered. It is hard for me to describe these, but one, of course, is between the Mitsubishi power output IC and the heat-sink itself, but there is another between the main heat-sink and what I guess I could call, an "extension" under that heat-sink, and BOTH areas must have the correct application of heat-sink compound in order to adequately remove the heat.
And furthermore, I really detest that white compound anyway. I much prefer that silver-bearing stuff I use for computer CPUs..
Now, Icom America still sells the 30 watt version of the Mitsubishi power ICs, but they want $80 for one. However, they no longer have or sell the 60 watters. In my experience and my general feeling about this, I strongly suspect that the 60 watt power ICs were always unreliable, although I am also somewhat convinced that the main reason they were unreliable in the F521 was due to incorrect application of the heat-sink compound by the OEM.
Thanks for the info. I very much appreciate your kindness.
Ken W7EKB