There are also multi-layered circuit boards, not individual boards that plug into each other, that’s “stacking”, but separate boards sandwiched together permanently, giving the appearance of one board. Certain connection points between boards may be made (or left vacant), depending upon design using these solder points.
I am not saying these multi-layered boards are used in the scanner, I have no idea. But they ain’t cheap, the design process is involved, making sure components don’t interfere with each other simply by close physical proximity to each other, not to mention the elaborate manufacturing involved. And I don’t know if they are being used in a deliberate manner for hysteresis or eddy current (an antenna of sorts where either of those globs of solder are actually acting as circuitry components. Another thought is the tabs are simply a way of dissipating internal circuitboard heat. So, from a cost standpoint, if I were to guess, I’d say multi-layered boards are not used and you can disregard all that I have written here… although I HAVE run these scenarios by an engineer who works with multi-layered circuit boards for satellites, who tells me all are viable considerations (with the exception of the hysterisis and eddy current suggestions which he finds a bit over the top… but it did cause him a moment of pause. He also volunteered a known phenomina when working with a satellite’s longevity… that of “whiskers”. A whisker is the interactivity between components that actually complete electrical paths and short them out!).
But your query is well taken, the need to identify the solder globs purpose BEFORE going forward with any thoughts of using them for whatever purpose. Sorry I couldn’t identify them for you.