First time I have heard of one of these devices fail.
to replace though, it means removal of the board. you will need an SMT thermal solder station with maybe 4 or5 MM nozzle.
Set temperature to 425°.
Apply heat to the device while gently lifting the device with LONG tweezers (thermally insulated is better)
The solder will melt and lift the device off the board. you can clean off excess solder with a conventional pencil and wick.
Don't work to heavy on the PC board etching so as not to damage it. Be careful not to dislocate nearby components.
You will need also, a syringe of solder paste.
Place the new device in the proper position with the contacts aligned with the etching.
Run a bead of solder paste along the contacts, both sides.
With the heat gun, apply heat to the beads until the solder melts and flows under and onto the contacts.
Try to avoid hairs that cause shorts.
If you have not done SMT rework before, I suggest you go on youtube and review the many SMT rework videos until you think you are ready for this.
Now before you go to all this work, confirm the device has failed with the proper troubeshooting procedures in service manuals.
Just no RF power output does not mean the final PA has failed. these fets can take 50 volts on the drain, Open or shorted antenna output at full power. Now if the device has a crater on top, its obvious.
Re mounting the board, Use a generous coating of Z1 thermal compound. tigten screws very snug but don't strip the threads.
Cheers
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