SDS100 Heat

[MrThompson]

Since CPUs were mentioned, the primary mechanism for heat related CPU failure is electron migration.

 

[radio3353]

Since CPUs were mentioned, the primary mechanism for heat related CPU failure is electron migration.

Electron migration? Never heard of it. Are you talking about electromigration? I have performed experiments with flux residue on circuit boards and electromigration and it is fascinating to watch the whiskers grow to the point of creating shorts between conductors.

 

[MrThompson]

Electromigration. I shouldn't dictate posts while having dinner...

 

[Ubbe]

Thanks for the repeat, it can't be stressed enough that heating up and then cooling down are something that will really kill products if they are not designed with that in mind.

A solder joint exposed to constant excursions from hot to cold or vice versa is the joint that may fail.

...and with heat and then the colling down it will make things expand and contract that stresses all non-flexible connectors in the scanner, that includes the J401 that have some unusual high failure rates due to the solderings coming loose. It is lead free solder so it is more prone to crack than the older more flexible solder.

 

[vikingegfd]

IF you leave it in the sunlight during the summer or place it lying down on a cloth surface the scanner will heat up more then usual, thats how my first SDS100 got a trip to the Uniden repair shop. last week I forgot and left it in the sun and it got HOT. And yes it's up to date on software.